Teklease

Teklease

Guarniflon TEKLEASE release film products have been specially formulated to suit a variety of individual composite process applications. Release films are used to separate and release the laminate from the vacuum stack following the cure of the composite component.

TEKLEASE films are supplied both as perforated and unperforated to allow resin and volatiles to bleed out of the laminate and coloured for easy identification. The selection of a release film should be based on the resin system being used, the temperature and pressure of the cure cycle, the shape of the component to be cured and the amount of resin bleed that is required.

For example, release films that have higher elongations, will be more suitable for complex curvatures, though tailoring the film is recommended to ensure no bridging of the film occurs. It is important to remember that the mechanical performance of a film is dramatically affected by the presence of the perforations. Rolls of TEKLEASE should be stored and handled in clean and dry conditions to prevent any contamination onto the final composite component.



MATERIAL PROPERTIES

CODE DESCRIPTION MAX USE TEMP. (°C) ELONGATION AT BREAK (%) COLOUR
ET6200 ETFE 232 350 Blue
FE5000 FEP 260 280 Red
MRF1 PTFE 315 250 Natural
MRF2 Modified PTFE 315 400 Natural


AVAILABILITY

CODE THICKNESS (μm) MAX WIDTH (mm) ROLL LENGTH (mt) OTHER
ET6200 15, 20, 25, 50 1220, 1530, 1780 153 Perforation available
FE5000 13, 20, 25, 50 1220, 1530, 1780 153 Perforation available
MRF1 25, 50 1220 On request  
MRF2 25, 50 1220 On request  

NEWS& EVENTS

Thursday, 17 October 2019 07:04

GUARNIFLON AT AIRTEC 2019 – MUNCHEN – AEROSPACE MEETS AUTOMOTIVE

We attended from 14 to 16 of October an important event hold in Munchen, based on BtoB and concerning the future of mobility,

Read more
Tuesday, 10 September 2019 08:08

FLONTECH – THE NEW LOGO

After some years of use, Flontech logo has been re-stylized into a more modern graphic design, taking the occasion of the new web site and leaflets launching some new product families as well.

Read more